Description
Expert grade UV-559 BGA solder paste flux with a squeezing tube and a free needle tip.
Brand new and of the highest caliber.
Excellent immersion and intense joint.
Leaves no residue behind and is simple to remove with hands or tweezers.
Not suitable for oxidizing bronze, copper, phosphorous, or gold.
During assembly, avoid contamination.
UV-559: thick, unclean flux for reprocessing PCB, BGA, and PGA circuit boards and soldering computer and phone chips.
High-quality alloyed powder and resinic pasty flux are combined to create UV-559, which may prevent light yellow residue.
strong joints with a high soak rate.
no corrosive, no poisonous, and excellent insulating properties.
Smooth welding surface and good insulation.
Not degraded or dried out.
No toxins, no rust, and no component damage
